In the field of IC chip manufacturing, plasma cleaning technology has become an irreplaceable mature technology!

Why is it said that plasma cleaning technology has become an irreplaceable and mature technology in the field of IC chip manufacturing? Today, please follow the footsteps of the editor and approach the application of plasma cleaning machines in the field of chip manufacturing together.

I often receive feedback from many manufacturers that during the packaging process, due to surface contamination, cleaning can reduce issues such as delamination, virtual soldering, and open circuits, reducing the risk of packaging failure. Organic oxide substances, metal impurities, photoresist residues, and other pollutants may remain on the surface of chips and PCB circuit boards, affecting subsequent dispensing and other processes. How plasma cleaning technology can penetrate into the tiny gaps and holes on the chip surface to achieve extremely high cleanliness and provide atomic level clean surfaces for subsequent packaging processes? Let's explore the mysteries together!

The plasma cleaning equipment, with its plasma cleaning and activation modification technology, can change the chemical properties of the chip surface, increase surface energy, and make it easier to combine with other materials. Through plasma treatment, with the help of droplet angle testing or dyne pen testing, it is evident that the droplet angle on the chip surface has decreased and the surface has become more hydrophilic.

Plasma cleaning machines can not only adapt to complex structures, but also to modern high-density and high-precision chip packaging, where plasma cleaning can adapt to complex structures and small sizes.

What are the common and significant characteristics of chips after plasma cleaning technology treatment?

1. The wetting performance of the chip surface is further enhanced, which can enable better coverage and filling of packaging materials, reducing voids and peeling phenomena.

2. Introducing polar groups into chips can significantly improve the bonding strength of processes such as wire bonding and flip chip soldering.

3. Plasma cleaning technology can clean the residue of photoresist and improve the packaging reliability of PCB circuit boards

4. Plasma cleaning technology uses inert gases or common gases without generating harmful chemical waste liquids and exhaust gases, which meets environmental requirements and does not damage the performance of the product.

5. Plasma cleaning machines have relatively low energy consumption and operating costs.

6. Plasma cleaning machines have a wide range of applicability and are compatible with various materials, such as metals, semiconductors, rubber, automotive components, polymer materials, etc. They can perform plasma cleaning on various materials to meet the needs of different packaging processes.

In summary, the application of plasma cleaning in the pre-treatment of chip packaging has obvious advantages, which can effectively improve the quality and reliability of packaging. It is an indispensable and important link in modern semiconductor packaging technology. Plasma cleaning technology can not only effectively improve the activity of the chip surface, but also greatly enhance the flowability of the epoxy resin adhesive adhered to the chip surface, enhance the adhesion permeability between the chip and the packaging substrate, reduce the delamination between the chip and the substrate, improve the thermal conductivity, enhance the stability and stability of IC packaging, and extend the product life.