Why is a plasma surface cleaning machine used before semiconductor packaging, and what is the effect?

With the continuous development and growth of semiconductor technology, the demand for processing art is increasing, especially for semiconductor chip wafers, which are becoming increasingly strict. Many manufacturers have stated that particles and metal material stains on the wafer surface can seriously affect the product quality and qualification rate of electronic components.

In the process of semiconductor chip processing, almost every step needs to be cleaned. Considering that wafer cleaning is the most important and crucial process in semiconductor technology, the quality of its process technology products will directly affect the qualification rate, stability, and safety of electronic components. As a modern dry cleaning technology, plasma surface cleaning machines have characteristics such as environmental protection and energy saving.

The magical role of plasma cleaning equipment in the field of new energy is as follows:

1. Common micro light particles can leave various polymers, conductive silver paste, and etching residues on the surface of products. The conventional removal method for these pollutants is mainly to clean the screened particles through physical or organic chemical means.

2. Microorganisms, conductive silver paste and other pollutants may remain on the surface of wafers and semiconductors, resulting in incomplete cleaning of the wafer surface. With the help of plasma cleaning machines, the wafer surface can be cleaned to improve the packaging quality of the surface.

3. The plasma surface cleaning machine can effectively remove organic pollutants such as photoresist, grease, fingerprints, etc. from semiconductor chips. If these pollutants are not removed, it will affect the sealing and adhesion of the packaging. For example, photoresist residue can hinder the tight bonding between chips and packaging materials, resulting in gaps after packaging and affecting product performance.

4. Online plasma cleaning equipment can quickly remove impurities and oxides from the surface of PCB circuit boards. Metal impurities may cause electrical short circuits and other problems, while the presence of oxides can reduce surface activity, which is not conducive to subsequent packaging processes. Plasma cleaning can remove these impurities and oxides, achieving higher surface cleanliness.

5. Semiconductor plasma cleaning machine can improve the surface activity of semiconductors, increase surface energy, make the bonding between chips and packaging materials more firm, and improve the reliability of packaging. For example, after frequent plasma cleaning, the atomic arrangement on the surface of the chip becomes more orderly, and the bonding strength between plasma cleaning technology and materials such as packaging resin can be increased by 30% to 50%.

6. On the surface of untreated chips, epoxy resin may accumulate locally or cover unevenly. Plasma cleaning equipment can significantly improve the wettability of semiconductor surfaces, allowing packaging materials to better expand and cover the chip surface. Taking epoxy resin as an example, after plasma cleaning in semiconductor packaging, the epoxy resin can uniformly cover the surface of the chip, improving packaging quality and consistency.

In summary, the series of plasma cleaning machine models developed by Zhenyi can effectively improve packaging quality and reliability, enhance product performance and stability, reduce defect rates, and play a rare and important role in the field of chips by using vacuum plasma cleaning machines before semiconductor packaging.