What are the application characteristics of plasma surface cleaning machine in semiconductor packaging!

Plasma cleaning treatment can be specifically applied to the packaging of advanced semiconductor surfaces, or to perform plasma cleaning treatment before crystal dot bonding, which can improve the quality of wire bonding!

IC chip integrated circuits can be improved by using appropriate plasma treatment, including improving the adhesion of the die surface and enhancing wire bonding strength. Vacuum plasma cleaning machines can enhance the adhesion of epoxy resin through surface activation treatment, thereby improving the bonding between the die and substrate. Plasma treatment can remove surface oxidation, and plasma technology can be used for plasma cleaning of solder pads before wire bonding to increase bonding strength and yield.

Next, we will provide a detailed introduction to the application characteristics of plasma cleaning equipment in the semiconductor field

1. It can effectively remove organic pollutants from the surfaces of chips, substrates, frames, etc., providing a high cleanliness surface for subsequent processes.

2. As a dry cleaning technology, compared with traditional wet cleaning, it avoids the corrosion and damage that chemical solutions may cause to the wafer surface, while reducing the steps and costs of wastewater treatment.

3. Through plasma treatment, different chemical functional groups can be introduced on the surface of the material, changing the surface chemical properties, increasing surface energy and hydrophilicity, and improving the adhesion, wettability, and bonding properties of the material surface.

4. Plasma cleaning can improve the microstructure and chemical properties of material surfaces, reduce voids and delamination at interfaces, and enhance the reliability of packaging.

5. Plasma cleaning technology can achieve overall, local, and complex structure cleaning, suitable for various complex structures in semiconductor and optoelectronic component packaging.

6. Plasma cleaning can significantly improve the strength of wire bonding and the uniformity of bonding wire tension, enhancing the reliability and yield of devices.

Plasma can effectively remove surface pollutants and organic residues, ensuring that subsequent processes treat clean and uniform materials. By using plasma treatment, the production process can be optimized to achieve efficient and repeatable surface treatment. Plasma treatment improves the adhesion of molding materials by increasing the surface energy of the substrate, which not only enhances surface adhesion but also improves packaging reliability. Plasma treatment enhances the surface energy of materials, thereby achieving stronger bonding of adhesives, coatings, and inks. Plasma treatment technology can not only be applied to integrated circuits and semiconductors, but also to fields such as polymers, metals, glass, electronic products, silicone rubber, etc. If you want to learn more about plasma cleaning technology, please follow the official website of Zhenyi Co., Ltd!