How to choose a plasma cleaning machine, this article will help you avoid detours:

Plasma processing machines are different from conventional wet cleaning equipment in that plasma is a neutral state, also known as the fourth state of matter, rather than the common three states of solid, liquid, and gas. It adds enough energy to the gas to ionize it into a plasma state.

The "active" components of plasma include ions, electrons, atoms, active groups, excited state nuclides, photons, etc,

Low temperature plasma treatment machine utilizes the properties of these active ingredients to treat the surface of samples, thereby achieving cleaning and activation modification purposes. As a cleaning process developed in recent years, plasma treatment machine provides an economical and effective solution for surface cleaning problems without environmental pollution, which can ensure maximum surface activation of various materials. Today, let's analyze and learn about the cleaning process and characteristics of semiconductor surfaces treated by plasma cleaning machine:

With the continuous development and growth of semiconductor technology, especially the increasingly strict demand for semiconductor and wafer process components, the main reason is that various impurities and residues will remain on the surface of the wafer, which will seriously affect the product quality and reliability of electronic components. Normal particles are mainly pollutants such as conductive silver paste, which affect the composition of geometric shapes and the main parameters of electrical engineering in the etching process of electronic components. The removal method of this pollutant is mainly to clean the bottom of the particles through physical or organic chemistry, gradually reducing their contact range with the wafer surface, and finally removing them.

The effects of plasma treatment on wafers are as follows:

1. The cleaning effect on the wafer surface will be significantly improved: Plasma treatment machines can use plasma cleaning technology to form plasma on the wafer surface. Through the collision and chemical reaction between plasma and surface impurities, organic and inorganic pollutants on the surface can be removed. Compared to traditional chemical cleaning methods, plasma processing machines can more accurately control cleaning parameters such as plasma density, energy, etc., thereby improving the cleaning effect and making the wafer surface cleaner,

2. Continuous cleaning to improve the speed and efficiency of cleaning: Plasma processing machines can use high-energy plasma beam cleaning technology to clean large areas of

 semiconductors in a short period of time. Its cleaning speed is faster than traditional chemical cleaning methods, which can greatly improve production efficiency. Plasma cleaning machines also have highly automated characteristics, which can achieve continuous cleaning of wafers and further improve cleaning speed.

3. Natural oxide layer can be removed: Low temperature plasma cleaning machines can remove the natural oxide layer on the surface of semiconductor materials through the reduction effect of plasma, restoring the original electrical properties of the material.

4. Environmental protection and energy conservation: Plasma cleaning belongs to a dry process, which does not require the addition of chemical agents, does not discharge wastewater, and does not pollute the environment. At the same time, it has low energy consumption and operating costs.

In summary, plasma cleaning can make the wafer surface hydrophilic or hydrophobic as needed, and can also change the surface roughness through etching.