Did you know that many pollutants on the surface of semiconductor components that may have a negative impact on adhesion are not always visible during plasma cleaning?

They can exist on the surface at the microscopic level: plasma cleaning plays a very important role in the production of various parts and products in the semiconductor manufacturing industry. Compared with other surface cleaning or activation methods, it can efficiently save time and labor costs, while improving the performance of bonding, coating, plating or other applications. Plasma cleaning is a very clean and efficient step that can improve overall product quality.

Normally, pollutants can inhibit coating or adhesion during the manufacturing process, leading to fish eyes, bubbles, or other adhesion issues that may cause serious problems. 

These issues often lead to waste, wastage, and loss of profits. Performing plasma cleaning before these bonding and electroplating processes can alleviate many of these issues. Plasma cleaning technology can clean surface residues and improve the performance of coatings or plating during manufacturing, as the plasma cleaning process can adhere to the substrate without interference from pollutants.

The plasma cleaning machine removes impurities or foreign objects from the surface at the microscopic level and ensures that the surface remains in its original state for subsequent bonding. The plasma cleaning machine can clean residual organic matter such as photoresist on the surface, thereby enhancing the welding force on the surface.

Plasma cleaning machines have many benefits in the manufacturing process, including no additional time, short production cycle, low cost, and high adhesion performance. 

There is no extra time, as the plasma cleaning step usually eliminates another basic cleaning step; In addition, the plasma cleaning process is usually faster. Compared with primer or other chemical surface preparation steps, plasma cleaning process has a lower cycle time because simple cleaning processes can be completed in batches with shorter cycle times. 

The very low operating cost can reduce the start-up cost of purchasing plasma systems. Plasma cleaning can quickly clean the surface of workpieces. The longer the plasma system is used in manufacturing, the lower the overall cost. Performing plasma cleaning on the surface before bonding or electroplating will produce higher adhesion performance between the coating and material surface, and help improve overall product quality and positive customer feedback.

To learn more about plasma cleaning machines and their benefits in semiconductor manufacturing processes, please follow us to learn more about plasma cleaning technology.