source：本站author：超級(jí)管理員time：2024-12-19views：4599172
How to remove contaminants on the surface of wafers by plasma equipment:
The circular crystal packaging form is one of the advanced chip packaging methods. The quality of packaging form will directly affect the production cost and performance indicators of electronic devices. There are many types of integrated circuit packaging, which have undergone rapid changes along with technological innovation. However, its production process includes wire bonding, sealing, and curing within the integrated circuit mounting bracket. However, only packaging forms that meet the standards can be put into practical application and become terminal devices. In Shenzhen, the low-temperature plasma surface cleaning equipment produced and processed by Zhenyi Co., Ltd. is mainly used for advanced circular packaging, which can significantly reduce the consumption of organic chemistry and similar consumables, and protect the ecological environment.
The linear plasma cleaning equipment with multiple nozzles in the seismometer belongs to dry cleaning, and its actual working mechanism is to remove surface pollutants that are invisible to the naked eye from the crystal; The entire process of plasma cleaning equipment is to place the wafer into the vacuum reaction chamber of the plasma cleaning machine, then extract the vacuum to reach a certain vacuum value, and then fill it with reaction mixture gas. This reaction mixture gas is converted into organic chemical and physical reactions between plasma and crystal surface through ionization, converting into volatile components and being absorbed, thereby promoting the cleaning and wetting of the circular crystal surface.
The entire process of cleaning low-temperature plasma equipment:
1. After the entire crystal processing is completed, it will be directly packaged and tested on the crystal, and then the entire crystal will be cut into single bead crystals; The electrical connection part uses copper bumps instead of wiring methods, so there is no wiring or glue filling process,
2. The purpose of plasma treatment before packaging circular crystals is to remove inorganic substances on the surface, restore the oxide layer, increase the roughness of the copper surface, and improve the reliability of the product
3. Due to the needs of production capacity, there will be significant differences in the design of vacuum reaction chambers, electrode structures, airflow distribution, water cooling devices, uniformity, etc.
4. The basic requirement for successful ink adhesion is the dispersion of ink on the substrate. If the surface tension of the ink is lower than the surface free energy of the part, it will unfold. Surface energy can be defined as the excess energy on the surface of a material compared to the material itself. If the molecules of a liquid are more strongly attracted to each other than to the surface, then the liquid will not wet the surface well and instead form beads. On the contrary, if it is more attractive to the surface, the liquid will diffuse more.
5. Therefore, if a specific surface has higher surface energy, it is easier to wet. Due to the ability to wet surfaces being a simple definition of surface adhesion properties, it is easier to adhere/print/paint or adhere to surfaces.
The surface energy value of untreated PEEK is between tens of dynes, and plasma treatment can greatly increase the surface tension value of ink.
6. The plasma cleaning machine can not only meet its one-time small needs, but also meet the continuous production needs. Low temperature plasma cleaning treatment is a cost-effective method that can fully utilize the unique advantages of plasma treatment.
7. The Dain pen is used to measure the surface of plasma equipment materials, which is specifically designed to detect the (effective) results of material surface treatment. In testing, the interface tension detection pen can accurately detect whether the interface tension on the test pen meets the requirements of the test pen. Under different tensions, it can accurately detect whether the material interface tension reaches the test pen value. In the testing process, an intermediate value should be selected as the starting point. For example, in the 38mn/m detection, if the detection pen wets the surface of the substrate within 2 seconds and the interfacial tension of the substrate is greater than the selected value or just right, a larger value of the detection pen needs to be selected for a second detection. For example, by analogy, until the detection result turns into a water droplet (spherical) within 2 seconds, the value before detection is considered as the surface energy of the substrate. And used for comparative analysis. If the first detection shrinks into water droplets (spherical), use a smaller value detection pen for the second detection until the surface is moist. This method can accurately measure interfacial tension and surface moisture force, and determine whether the surface factors of the substrate meet the requirements before work to adapt to the needs of the operation. The application of an interfacial tension tester in plasma devices can conveniently analyze subtle changes in surface energy, hydrophilicity, wettability, and other properties of different solids.
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