source：本站author：超級管理員time：2024-12-11views：88091
What is the principle of using vacuum plasma cleaning equipment for processing on PCB circuit boards?
Nowadays, with the development of the times and the increasing industrial demand, the types of printed circuit boards have also undergone changes. Nowadays, the demand for new printed circuit boards such as multi-layer, high-frequency boards, and rigid flex combinations is gradually increasing. This type of printed circuit board also brings new technological challenges. For products that may have special requirements for hole wall quality of special boards, using a linear plasma cleaning machine for processing can achieve the effect of roughening or removing surface residues, which has become an irreplaceable method of new technology for printed circuit boards. At present, the miniaturization, portability, and multifunctionality of electronic products require that the carrier PCB of electronic products cannot be simplified or high-density.
Plasma not only has the function of removing drilling dirt, but also has other functions such as cleaning and activation. The cleaning method of linear plasma cleaning equipment can effectively overcome the defects of wet removal of adhesive residue, achieve better cleaning effects on blind holes and micropores, and ensure excellent results during blind hole electroplating and filling.
Nowadays, with the development of PCB technology, plasma cleaning machines combining printed circuit boards will be the main development direction in the future, and vacuum plasma cleaning machine technology will play an increasingly important role in hole cleaning production just combined with printed circuit boards.
So how long does the timely performance of the plasma cleaning machine last? In fact, the timeliness of plasma cleaning machines is complex, possibly due to the dynamic recombination of material surfaces. Affected by factors such as gas type, processing parameters, chemical composition, crystal structure of processing materials, and storage environment of processing materials. After treatment with a plasma cleaning machine, active functional groups are introduced into the surface of the material to improve its surface ability. However, these active functional groups are not stable. The specific process is as follows:
As the molecular chain rotates or moves freely, the active groups gradually shift towards adjacent molecules or groups. Even within the technology, the system tends to stabilize, and surface activity rapidly increases over time. If the storage environment of the product after plasma treatment is not ideal, various particles and organic pollutants will be adsorbed on the surface, thereby reducing the surface energy of the material. If the processed material contains low antioxidant, plasticizer, antistatic agent, lubricant, coloring agent, pigment, stabilizer and other polymers and low molecular weight additives. This will lead to molding. The longer the storage time, the higher the storage temperature, and the faster the material surface drops.
When the surface of the material processed by the plasma cleaning machine is subjected to external forces such as friction, the surface molecules of the material will detach or recombine, thereby reducing the surface of the material. How long will the performance of the plasma cleaning machine last? Due to the nature of the data itself, secondary pollution after processing, chemical reactions, and other reasons, the preservation time of the processed appearance has not been well confirmed, so this is an unconfirmed issue. In theory, vacuum packaging can be chosen to delay the aging of plasma cleaning machines. In general, we recommend that customers achieve higher external energy through low-temperature plasma treatment and immediately reduce the impact.
Linear plasma cleaning machines are time sensitive and require testing of customer specific products and processes to increase surface area. Unfortunately, we are unable to improve the exact shelf life after cleaning. Due to the fact that plasma cleaning is a process of physical and chemical changes, and the products and processes are different, the active molecules on the surface of the material are easily chemically changed with other substances when the products are exposed to air, so there is no standard time sensitive answer.
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