Due to its complex design and tiny holes, maintaining cleanliness and non pollution is a huge challenge for all cleaning and spraying equipment, which is where PCB plasma cleaning machines come into play. So, how does it remove high-frequency PCB hole walls? Next, with an understanding of plasma cleaning machines, let's explore the field together.

Firstly, we need to know what a PCB plasma cleaning machine is. This is a device that uses plasma cleaning technology under normal pressure for surface cleaning. Its working principle is mainly to generate a large number of self centering particles through ionization and stimulation, which can effectively remove various pollutants on the surface, including organic and inorganic pollutants.

Then, let's take a look at how the plasma cleaning machine removes high-frequency PCB hole wall drilling. When the plasma cleaning machine is running, the current ionizes the liquid through a special cleaning solution, forming plasma.

This plasma has strong oxidation-reduction ability and can effectively decompose and remove drilling dirt on the hole wall. Meanwhile, the temperature during the cleaning process can also kill potential bacteria and viruses, ensuring that the cleaned PCB components are completely sterile.

In addition, the PCB plasma cleaning machine also has the following advantages: good cleaning effect, which can effectively remove various pollutants; Fast cleaning speed greatly improves production efficiency; Has minimal impact on PCB and can achieve efficient and low damage cleaning.

The PCB plasma cleaning machine utilizes its unique plasma cleaning technology to successfully remove PCB holes and wall drilling, ensuring the cleaning and quality of PCBs, which is particularly important for the quality and reliability of electronic products.

The surface activation of plasma cleaning equipment can generally be used for surface treatment of various materials. Hydrophilic groups such as carbon, carboxyl, and hydroxyl can improve the adhesion, hydrophilicity, and bonding of raw materials through chemical reactions between plasma and material surfaces. To improve ink adhesion.

Plasma surface treatment can clean the surface of polymer materials, break the molecular bonds on the material surface, form stable hydrophilic groups, and improve ink adhesion. When the price of ink samples is high, it can also reduce ink usage and lower costs.

The plasma cleaning machine can mainly remove some nanoscale organic pollutants and some particles that are invisible to the naked eye. Its working principle is that the plasma reacts with the pollutants on the surface of the workpiece, and the volatile substances are carried away, forming an ultra clean workpiece surface.

Taking the mobile phone motherboard in the precision electronics industry as an example, the motherboard interface is mainly composed of conductive copper foil, epoxy resin, and glue.

If the motherboard interface needs to be connected to the circuit, it is necessary to first drill holes on the motherboard to form tiny pores and connect the circuit. After drilling, there will be some residual adhesive residue in the micropores, which will directly cause peeling during copper plating. Even if there is no peeling during copper plating, there will still be a short circuit due to residual adhesive during subsequent use.