The processing effect of atmospheric plasma cleaning machine in improving the reliability of wire bonding quality is mainly reflected in the following eight aspects:

1. Removing pollutants: Plasma cleaning can effectively remove oxides on the surface of aluminum and other materials, providing a clean welding surface and improving the yield and bonding strength of subsequent metal bonding processes. The atmospheric pressure plasma cleaning machine can effectively remove organic matter from the bonding area of the lead frame. If these pollutants are not treated, they can lead to low bonding strength and significant differences in bonding stress, affecting the long-term reliability of the product.

2. Improve surface chemical energy and wettability: Plasma cleaning improves the long-term reliability of products by increasing the surface chemical energy and wettability of the bonding zone, reducing the failure rate of bonding.

3. Improve wetting performance: After low-temperature plasma cleaning, the contact angle of water droplets on the surface of the solder pad is significantly reduced, indicating that plasma cleaning can effectively improve the hydrophilicity of the bonding surface and reduce the surface tension of the solder pad, which is beneficial for the spreading of solder balls and the formation of a good bonding interface. Low temperature plasma cleaning can significantly improve the wetting performance of the substrate surface and enhance the bonding strength, which is crucial for the subsequent wire bonding process. Plasma treatment can change the surface functional group state, increase the bonding surface free energy, and form highly polar chemical groups, which is beneficial for improving the adhesion of the bonding interface.

4. Improve bonding strength: By plasma cleaning, the bonding strength of the lead frame can be significantly improved, thereby achieving good reliability.

5. Reduce bonding failure: Plasma cleaning can reduce the failure during wire bonding process. According to statistics, more than 80% of product failures in hybrid integrated circuits are caused by bonding failure. Low temperature plasma cleaning can effectively remove pollutants in the bonding area and reduce this proportion.

6. Improving welding quality: Plasma cleaning can improve the wetting ability of material surfaces, enabling various materials to be coated, plated, and other operations, enhancing adhesion and bonding strength.

7. Optimize wire bonding process: Microwave plasma cleaning technology uses high-energy plasma excited by microwaves to treat the surface of the workpiece at the molecular level, remove stains, improve surface properties, optimize wire bonding process and clean other products, improve efficiency, and demonstrate excellent cleaning effects.

8. Improving packaging quality: In microelectronic packaging, plasma cleaning technology is increasingly being used for cleaning and activating packaging materials, which plays a positive role in solving the risks of surface contamination, unstable interface conditions, poor sintering and bonding of electronic components, and improving quality management and process control capabilities.

In summary, plasma cleaning machines play a crucial role in surface treatment before wire bonding. They not only improve bonding quality, but also enhance product reliability and performance. The successful application of plasma cleaning technology depends on the optimization of process parameters, including process pressure, plasma power, time, and process gas type. Different process parameter settings directly affect the plasma cleaning effect, so appropriate process parameters should be set for different cleaning objects and process requirements for cleaning.

The plasma cleaning machine has a significant improvement effect on the wire bonding effect of chips and other components, mainly by increasing surface cleanliness, surface energy, wettability, and bonding strength, reducing pollutants, and thereby enhancing the reliability and quality of bonding.